采用分子动力学模拟了压力容器模型材料Fe-0.05Cu和Fe-0.3Cu合金的级联碰撞过程,研究了辐照导致的缺陷构型及其特征能量、Cu的空位迁移机理、Cu含量对初始损伤的影响、辐照温度对间隙原子团簇和空位团簇的影响等.结果表明,Cu对级联碰撞产生的缺陷数量、湮灭和复合没有明显影响,但可降低空位迁移能.辐照温度对团簇有明显影响.
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